Distinguished Lecture

An Engineering Perspective on Leadership (ECE Alumni Merit Award Winner)

Dowson Tong

Senior Executive Vice President; President of Social Network Group; Chairman of Tencent Music Entertainment Group, Tencent
Friday, October 05, 2018
09:45am - 10:45am
3316 EECS

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About the Event

Mr. Tong, the ECE Alumni Merit Award winner for 2018, has run software engineering organizations for over twenty years in various capacities. He has found many engineering techniques useful not only in solving engineering problems but also in managing teams/projects, architecting organizations, and even guiding one’s career. He is grateful for his engineering training at Michigan, which helped him gain insights into many complex systems that involve people and resource management.


Dowson Tong joined Tencent in 2005 and currently serves as Senior Executive Vice President of Tencent, President of the Social Network Group, and Chairman of the Tencent Music Entertainment Group. Since October 2008, he has led the research and development of Tencent’s social networking platform and value-added services. Dowson currently oversees Tencent’s QQ messaging and Qzone social networking platforms, Tencent Music Entertainment Group and Tencent Cloud. He also co-leads Tencent’s social advertising business.

Headquartered in Shenzhen, China, Tencent is an internet-based technology and cultural enterprise which aims to provide platforms and services that connect “everything.” Tencent’s offerings provide entertainment and cultural enrichment to more than one billion users, globally.

Prior to joining Tencent, Dowson worked at Sendmail Inc., where he led the development of operator-scale email and messaging systems, and at Oracle, where he worked on the development and testing of the Oracle Server and Oracle Applications.

Dowson received a Bachelor of Science degree in Computer Engineering from the University of Michigan in 1994 and a Master of Science degree in Electrical Engineering from Stanford University in 1997.

Additional Information

Sponsor(s): EECS

Open to: Public